用于無(wú)氰電鍍、染色、精制陶土等;
　　Used for cyanide-free plating, dyeing, refined clay, etc.
　　1 主要用于無(wú)氰電鍍，替代氰化鈉作為電鍍的絡(luò)合劑。也用作電鍍的前處置劑和焦磷酸電鍍液。配制衣料用洗濯?jiǎng)┙M分、金屬外表清洗劑和瓶子洗凈劑組分、各種清潔劑的添加劑。用作陶瓷工業(yè)的黏土分散劑，顏料和染料的分散劑弛緩沖劑。漂染工業(yè)用于除去水中的少量三價(jià)鐵離子，進(jìn)步漂染質(zhì)量。 焦磷酸鉀亦是雙氧水的穩(wěn)定劑。
　　1. It is mainly used in cyanide-free electroplating instead of sodium cyanide as complexing agent for electroplating. It is also used as pre-disposal agent and pyrophosphate electroplating solution. Composition of laundry detergent, metal surface detergent and bottle detergent, additives of various detergents. Used as clay dispersant, dispersant relaxant buffer for pigments and dyes in ceramic industry. The bleaching and dyeing industry is used to remove a small amount of trivalent iron ions from water and improve the quality of bleaching and dyeing. Potassium pyrophosphate is also an excellent stabilizer for hydrogen peroxide.
　　2 在食品工業(yè)中用作乳化劑，組織改良劑，螯合劑，還用作面制品用堿水的原料。多與其他縮合磷酸鹽合用，通常用于避免水產(chǎn)罐頭產(chǎn)生鳥糞石，避免水果罐頭變色；進(jìn)步冰淇淋收縮度，火腿、香腸的得率，磨碎魚肉的持水性；改善面類口味及進(jìn)步得率，避免干酪老化等。
　　2. It is used in food industry as emulsifier, tissue improver, chelating agent, and as raw material of alkali water for flour products. It is commonly used in conjunction with other condensated phosphates to avoid the formation of bird droppings in canned aquatic products and discoloration of canned fruits; to improve the shrinkage of ice cream, the yield of ham and sausage, the water holding capacity of ground fish; to improve the taste and yield of noodles, and to avoid cheese aging.
　　3. 焦磷酸鉀也可用作堿性化學(xué)鍍鎳的絡(luò)合劑以及用于配制洗濯?jiǎng)?。焦磷酸鹽也可用作堿性電鍍鎳的絡(luò)合劑。
　　3. Potassium pyrophosphate can also be used as a complexing agent for alkaline electroless nickel plating and as a detergent. Pyrophosphates can also be used as complexing agents for alkaline nickel plating.
　　銅鍍層普遍用于鋼鐵件多層鍍覆以及鍍錫、鍍金和鍍銀等的“底”層，以進(jìn)步基體金屬與鍍層的分離力。當(dāng)銅鍍層無(wú)孔時(shí)，可大大進(jìn)步外表鍍層的抗蝕性。目前，工業(yè)上普遍的電鍍銅辦法是運(yùn)用含氰化物鹽類的鍍液，氰化鍍液的缺陷是具有毒性，在運(yùn)用過程中對(duì)環(huán)境帶來危害。采用低毒或無(wú)毒鍍銅的辦法是電鍍行業(yè)的開展趨向。

　　Copper coating is widely used in multi-layer plating of iron and steel parts, as well as "bottom" layer of tin, gold and silver plating, in order to improve the separation force between base metal and coating. When the copper coating is porous, the corrosion resistance of the outer coating can be greatly improved. At present, the common method of copper plating in industry is to use cyanide-containing salt plating solution. The defects of cyanide plating solution are toxic and bring harm to the environment in the process of application. The development trend of electroplating industry is to adopt the method of low toxicity or non toxicity copper plating.
　　焦磷酸鹽鍍銅工藝成分簡(jiǎn)單、鍍液穩(wěn)定、電流效率高、均鍍才能和深鍍才能較好、鍍層結(jié)晶細(xì)致，鍍速快，電鍍過程沒有刺激性氣體逸出，是一種低毒、性能優(yōu)良的鍍銅辦法。焦磷酸鹽鍍液的主要成分是供應(yīng)銅離子的焦磷酸銅和作為絡(luò)合劑的焦磷酸鉀，此兩者能作用生成絡(luò)鹽焦磷酸銅鉀。焦磷酸鉀除了與銅生成絡(luò)鹽外，還有一局部游離于鍍液中，它能夠使絡(luò)鹽穩(wěn)定并可進(jìn)步鍍液均鍍才能和深鍍才能。因而，隨著國(guó)度對(duì)氰化電鍍禁限令的執(zhí)行，作為無(wú)氰電鍍的代表–焦磷酸鹽鍍銅將被更多的電鍍廠采用。
　　The process of pyrophosphate copper plating is simple in composition, stable in bath, high in current efficiency, good in uniform and deep plating, fine in crystallization, fast in plating speed and no irritant gas escaping from the plating process. It is a low toxicity and excellent copper plating method. The main components of pyrophosphate plating bath are copper pyrophosphate supplying copper ions and potassium pyrophosphate as complexing agent, which can react to form complex copper potassium pyrophosphate. In addition to complexing with copper, potassium pyrophosphate also partially dissociates from the plating bath, which can stabilize the complexing salt and improve both plating and deep plating abilities. Therefore, with the implementation of the national ban on cyanide plating, pyrophosphate copper plating, as the representative of cyanide-free plating, will be adopted by more plating plants.
　　焦磷酸鹽鍍銅與氰化鍍銅比擬有一個(gè)缺陷，就是焦磷酸鹽電鍍液中存在著正磷酸鹽，隨著時(shí)間的延長(zhǎng)電鍍液中正磷酸鹽的含量會(huì)增加，將嚴(yán)重影響電鍍質(zhì)量。
　　There is a defect in the comparison between pyrophosphate copper plating and cyanide copper plating, that is, orthophosphate exists in pyrophosphate plating bath, and the content of orthophosphate in the plating bath will increase with time, which will seriously affect the quality of plating.